Weicon Easy-Mix Metal epoxy adhesive

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Cechy szczególne: Klej/uszczelniacz dwuskładnikowy, Odporny na wysokie temperatury, Wysoka przyczepność i adhezja

Pojemność opakowania: 50g

Przemysł: Motoryzacja, Obróbka i produkcja metali, Papier i Celuloza

Zastosowanie: Papier i tektura

Weicon Easy-Mix Metal epoxy adhesive

Ideal for bonding metal parts | semi-liquid | fast curing WEICON Easy-Mix Metal is ideal for service work where larger adhesive tolerances are required. WEICON FastMetal Minute Adhesive bonding fibre-reinforced materials, plastics, stone, glass, wood, ceramics, metals and many other materials

The Easy-Mix D 50 dispensing gun is required to process Easy-Mix products in 50 ml containers.

Application:

  • For low energy plastics
  • Perfect for gluing metal parts
  • For composite materials
  • To the stone
  • For glass
  • For ceramics
  • For wood
  • Shelf life 18 months at +20°C in a dry, dark place
  • Shelf life 6 months if these storage instructions are not followed

Features and Benefits:

  • Resistant to high temperatures up to +145°C
  • Shock resistant
  • Impact resistant
  • High adhesion
  • Sticky and stable
  • Color gray-green
  • Two-component glue
  • Semi-liquid

Technical data (data source TDS_10652050 pdf)

Base
Color after curing gray-green
Resin/hardener mixing ratio 1:1
Viscosity of the mixture 1.8 g/cm³
Mixture viscosity +20 °C (+68 °F) Paste
Application temperature +10°C to +30°C
Properties dense
Open time at +20°C 5 mins
Strength 35% 40 mins
Mechanical load transfer (50% strength) 2 hrs
Final strength (100%) 24 hrs
Maximum gap 4mm
Average resin strength DIN EN 1465
Pressure 10 MPa
Stretching 24 MPa
Bending 58 MPa
Tg at 90°C 32.5 °C
Tg room temperature 44.3 °C
Elasticity modulus 4,000 - 4,500 MPa
Shore D hardness 70
Tensile shear strength depending on material thickness 1.5mm DIN EN 1465
Thermal flow rate 0.286 mm²/s
Sandblasted steel 20N/mm²
Sandblasted aluminum 19 N/mm²
Thermal conductivity 0.51 W/m K
Hard PVC rough 11 N/mm²
Heat capacity 0.904 J/(g K)
Linear shrinkage 0.3%
Thermal resistance -50°C to +145°C
Specific resistance 4.57 10¹² ohm
Dielectric strength 17kV/mm
ISSA Code 75.530.12
IMPA Code 812952
Curing temperature +6°C - +40°C
Product number:
10046417
EAN
4024596069889

Application method:

The conditions for perfect bonding are clean and dry surfaces (cleaning and degreasing with WEICON Surface Cleaner). Smooth surfaces should be machined. WEICON Easy-Mix products can be applied directly from the double cartridge using a static mixer. Discard the first 5 cm of the adhesive. The adhesive is applied from one side. The open times given refer to a 10 ml mixture at room temperature. Larger quantities will cure faster due to the thermal reaction typical of epoxy resins. Higher temperatures shorten the curing time and the open time of the adhesive processing. (as a guide - each 10°C above room temperature shortens both times by 50%). At temperatures below +16°C the open time and the curing time are extended. From a temperature of approx. +5°C no further reaction occurs.

Safety and health

When using WEICON products, please observe the physical, safety, toxicological and ecological data and regulations in our safety data sheets (www.weicon.de)

Available packaging and accessories:

[ 50g ] [ Easy-Mix D 50 Dosing Gun ] [ Nozzle ] [ Dosing tips ]

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