Weicon Easy-Mix N 50 epoxy adhesive

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Cechy szczególne: Klej/uszczelniacz dwuskładnikowy

Pojemność opakowania: 50g

Przemysł: Obróbka i produkcja metali, Papier i Celuloza, Transport

Zastosowanie: Elektryczne, Papier i tektura

Weicon Easy-Mix N 50 epoxy adhesive

High adhesion strength | semi-liquid | self-leveling | long open time

WEICON Easy-Mix N 50 is used to bond many materials such as metal, plastic, composite fibre, ceramic, glass, stone or wood. N 50 is suitable for production and assembly processes.

The Easy-Mix D 50 dispensing gun is required to process Easy-Mix products in 50 ml containers.

Application:

  • For low energy plastics
  • For composite materials
  • For glass
  • For ceramics
  • For wood
  • For composite fibers
  • To the stone
  • For production and assembly processes
  • Shelf life 18 months at +20°C in a dry, dark place
  • Shelf life 6 months if these storage instructions are not followed

Features and Benefits:

  • Resistant to temperatures up to +100°C
  • Sticky and stable
  • Color slightly yellowish, transparent
  • Two-component glue
  • High adhesion strength
  • Semi-liquid self-leveling adhesive
  • long opening time

Technical data (data source TDS_10650150 pdf)

Consistency dense
Color Slightly yellowish, transparent
Operating temperature +10°C to +40°C
Mixture mass ratio, weight 1:1
Viscosity of the mixture at +20 °C 7,500 mPa s
Mixture density 1.07 g/cm³
Maximum gap up to 2mm
Open time at 20°C, portion 10 ml 45 min
Initial Strength (35% Strength) 120 min
Mechanical strength after (50% Strength) 24 hours
Final Strength (100% Strength) 72 hours
Contractility 2.0%
Tensile strength DIN EN ISO 527-2 35 MPa
Modulus of elasticity DIN EN ISO 527-2 2,000 - 2,500 MPa
Pressure resistance DIN EN ISO 604 90 MPa
Bending strength DIN EN ISO 178 50 MPa
Hardness (Shore D) DIN ISO 7619 55
Tensile shear strength depending on material thickness 1.5mm
DIN EN 1465
Steel 1.0338 sandblasted 17 N/mm²
Sandblasted aluminum 16 N/mm²
Hard PVC rough 11 N/mm²
Temperature resistance -50°C to +100°C
Tg after curing at room temperature (DSC) 49 °C
Tg at temp. (120°C) (DSC) 50 °C
Thermal flow rate 0.133 mm²/s
Thermal conductivity DIN EN ISO 22007-4 0.17 W/m K
Thermal capacity DIN EN ISO 22007-4 1.267 J/(g K)
Specific resistivity DIN EN 62631-3-1 1.32 10¹³ ohm
Dielectric strength DIN EN 60243-1 (20°C) >26kV/mm
IMPA Code 812981
Product number:
10046415
EAN
4024596069865

Application method:

The conditions for perfect bonding are clean and dry surfaces (cleaning and degreasing with WEICON Surface Cleaner). Smooth surfaces should be machined. WEICON Easy-Mix products can be applied directly from the double cartridge using a static mixer. Discard the first 5 cm of the adhesive. The adhesive is applied from one side. The open times given refer to a 10 ml mixture at room temperature. Larger quantities will cure faster due to the thermal reaction typical of epoxy resins. Higher temperatures shorten the curing time and the open time of the adhesive processing. (as a guide - each 10°C above room temperature shortens both times by 50%). At temperatures below +16°C the open time and the curing time are extended. From a temperature of approx. +5°C no further reaction occurs.

Safety and health

When using WEICON products, please observe the physical, safety, toxicological and ecological data and regulations in our safety data sheets (www.weicon.de)

Available packaging and accessories:

[ 50g ] [ Easy-Mix D 50 Dosing Gun ] [ Nozzle ] [ Dosing tips ]

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